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HP0-J43 Designing and Implementing HP SAN(R) Solutions

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HP0-J43 exam Dumps Source : Designing and Implementing HP SAN(R) Solutions

Test Code : HP0-J43
Test Name : Designing and Implementing HP SAN(R) Solutions
Vendor Name : HP
Q&A : 89 Real Questions

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HP Designing and Implementing HP

Autodesk develops generative design utility for HP and GE Additive 3D printers | killexams.com Real Questions and Pass4sure dumps

Autodesk, an award-winning American software company, has collaborated with HP and GE Additive to enhance generative design software tools that work directly with 3D printers.

in response to Autodesk’s Netfabb and Fusion 360, the design-to-print workflow for additive manufacturing should be integrated in HP Multi Jet Fusion and GE Direct metallic Laser Melting (DMLM) methods to enhance swift prototyping for production-competent 3D printed parts.

Robert Yancey, director of producing business approach at Autodesk, defined to Design news:

“To free up the complete cost of HP MJF printers, you need a very good design, a fine material, and an outstanding print procedure. Autodesk develops the design tools and know-how, HP develops the print manner, and HP with their fabric companions develops the materials. All aspects are required to obtain optimum efficiency.”

The HP Jet Fusion 3D 4210/4200 Printing Solution. Photo via HP.The HP Jet Fusion 3D 4210/4200 Printing solution. photograph by the use of HP.

A generative workflow

all through Formnext, HP announced a partnership with Autodesk to allow generative design capabilities across the total HP Multi Jet Fusion portfolio. Following this collaboration, Christoph Schell, President of 3D Printing and Digital Manufacturing, HP Inc., cited:

“Many industries equivalent to automobile, which goes through its largest transformation in additional than 100 years, are looking to new applied sciences and strategic partners like HP to aid them improved compete in this time of alternate.”

“we are working with innovators to change the style they design and manufacture, unlocking new applications, greater manufacturing flexibility, and greater innovation, efficiency, and sustainability across their product development lifecycle.”

in a similar fashion, Autodesk is working with GE Additive to streamline metal additive manufacturing. using GE Additive’s software algorithms, interfaces, and really expert statistics models, this workflow will offer predictive insights for charge and timeline projections in the early levels of design.

“Working with Autodesk will give an impressive design-to-print environment for our consumers, assisting lower the obstacles of additive adoption while accelerating a consumer’s time to first respectable half,” pointed out Lars Bruns, executive utility leader at GE Additive.

3D printed bike elements from HP. picture by the use of HP/ Motus.

imposing an conclusion-to-conclusion workflow

As a mutual client of Autodesk and HP, Penumbra Engineering, a u.s.generative design enterprise, lately used Autodesk’s design-to-print workflow to produce an ultrasonic sensing machine. This 3D printed half become designed to be lightweight and durable inside extreme environments.

“The Penumbra case analyze uncovers the price of HP working with Autodesk generative design technology,” brought Yancey.

“We’re supporting HP printers in Fusion 360 and Netfabb in order that HP multi-jet fusion customers have the design and print prep tools they want. We’re working with HP to deliver aid for the new metal printers.”

A 3D printed handheld transducer created by Penumbra Engineering. Photo via Penumbra Engineering,A 3D printed handheld transducer created by means of Penumbra Engineering. picture by way of Penumbra Engineering,

put up your nominations now for the 3D Printing trade Awards 2019.

additionally, for the latest 3D Printing business updates subscribe to our newsletter, follow us on Twitter and like us on facebook.

in search of a clean delivery within the new 12 months? consult with 3D Printing Jobs to begin your profession in additive manufacturing.

Featured picture shows 3D printed elements from HP. photo by the use of HP.


Randomised opinions of health programmes: from design to implementation | killexams.com Real Questions and Pass4sure dumps

This counsel is for the 2018/19 session.

Dr Mylene Lagarde COW 3.02

This course is purchasable on the MSc in world fitness policy, MSc in fitness coverage, Planning and Financing, MSc in foreign health coverage and MSc in international health coverage (fitness Economics). This route is obtainable with permission as an outdoor alternative to students on other programmes where rules enable.

Randomized trials have long been used within the medical world to look at various the efficacy of clinical remedies. currently, social scientists have all started the usage of the equal method, using random task to allocate materials or enforce a coverage intervention differently to different organizations, with a view to verify the causal results of the coverage of activity. The recognition of randomized reviews has grown primarily, but no longer solely, amongst researchers and policymakers in low- and core-salary settings.

Conducting a successful randomized contrast comprises many inter-linked steps and a good realizing of a number of statistical concepts. Randomized critiques additionally usually require to design and organise the records collection of central and valuable information, which involves a couple of critical steps to keep away from pitfalls.  it is hence primary to be aware these distinctive steps to design and implement randomised evaluations adequately, or to be able to critically analyse them.

This course proposes a arms-on and intuitive strategy to designing and conducting a randomised evaluation. within the first half of the route, we can focus on causes for accomplishing randomised critiques; how to design the randomise scan to be certain it solutions the query(s) of pastime (together with considerations of statistical power and sample measurement calculation); a way to cope with threats to randomisation. within the second half of the path, we will discuss functional concerns raised through primary records collection, including the way to most suitable measure consequences of pastime; the way to design decent equipment and how to behavior and control fieldwork.

Seminars should be designed to motivate students to seriously have interaction with the topics and follow the technical advantage taught. each and every seminar may be closely aligned with the lecture content material to supply students the chance to practice the brand new advantage. Case studies could be chosen from a lot of cultural backgrounds, to enable the presentation of a diverse latitude of settings and issues.

15 hours of lectures and 15 hours of seminars within the LT.

A draft protocol. college students will be asked to publish a short 1,500 note draft protocol with the aid of week 8. while some aspects of their work may additionally still be work in development (e.g. using bullet features), students should be expected to write up the first half of their protocol in a extra exact approach. The outlines might be graded and remarks given to students. This enables students to get helpful journey of writing at MSc level at LSE, and they'll also consider greater above all the expectations of the summative assessment. students should be capable of use this remarks of their writing of the summative work.

analysis suggestion (one hundred%) in the LT.

The objective of the analysis protocol (four,000 words max) could be to plot the randomised evaluation of a selected fitness programme. students can be requested to prefer one programme from a proposed list. they're going to even be given the choice to opt for their own intervention (pending agreement by way of their seminar chief).


HP ZBook Studio x360: A Convertible for Designers and extra | killexams.com Real Questions and Pass4sure dumps

HP is a pioneer within the laptop hardware industry. When it comes to laptops and convertibles, it continues to innovate with each and every product. The HP ZBook Studio x360 indicates that HP continues to be pushing the edge of industrial design in moveable workstations. With a base fee of $1,999, the HP ZBook Studio x360 may also be custom-made to swimsuit more than a few design and engineering wants. however this computing device isn't just engineering focused. With the alternative of a power sensitive Wacom stylus, visible artists are additionally within the move hairs for this convertible workstation.

The 15-inch Studio x360, weighs in at a mere 4.9lbs. and is 0.8-in thick. It’s extremely good looking, thin and light. When it involves uncooked horsepower, the Intel Xeon E-2186M, coupled with an NVIDIA P1000, grants for even essentially the most compute-intensive purposes, including 3D design, animation and video enhancing. The touch-display and not obligatory stylus put the Studio x360 up there with the Wacom Cintiq for visual artists.

First Impressions

Upon opening the box, the HP ZBook Studio x360 suggests a recent aesthetic with a smooth matte silver conclude, interesting angled corners and solid construction that's normal of HP laptops. What makes the Studiox360 stand out is HP’s consideration to detail and rugged reliability. crafted from precision-crafted machined aluminum, the desktop goes via 14 MIL-STD-810G3 assessments to make certain it might continue to exist some thing demanding clients can put it through.

Opening the very solid feeling lid requires a little finesse, yet it boasts just the correct volume of stiffness to make certain that it will remain within the accurate place you desire, even if mendacity flat on the desk, in tent mode or in tablet mode. The 15.6-in 4K IPS UHD contact-screen display is crisp and colourful. while it can be a little brighter, it's vivid adequate for time-honored use and works smartly even when in a brightly lit room but struggled in direct sunlight.

Navigation

The keyboard/trackpad design of the HP ZBook Studio x360 is normal of many normal laptops. although, considering the fact that this is each a touchscreen and a convertible, the consumer can exchange to tablet mode and work using both finger-based mostly gesture input or with the not obligatory Wacom stylus.

speakme of the stylus, this desktop configuration included a Wacom AES Pen, which is an optional accessory which you can get in case you purchase the equipment. The pen has a great believe. The 4096 degrees of power, tilt sensing and low latency make it a have to for any digital artist.

safety

The ZBook Studio x360 is loaded with points that make it a at ease platform in a couple of methods. To the lessen right of the keyboard is a effortless fingerprint scanner to simplify the login procedure. There’s additionally an infrared camera constructed into the bezel it's designed for Microsoft home windows howdy facial consciousness. that you would be able to also equip this laptop with an speedy-on privacy monitor to keep prying eyes from seeing what you’re engaged on.

anyway the actual security features available, HP is assisting you retain one step ahead of malware, rootkits and bios corruption. The HP bound birth is a self-healing BIOS that ensures your workstation will birth in the event you need it to.

Connectivity

whereas the HP ZBook Studio x360 is skinny and light, it does not skimp on inputs and outputs. On the right edge of the system, you’ll discover the energy port and vigor LED, two Thunderbolt three (USB-C) ports, HDMI port, headset jack and an SD card slot.

On the left edge of the device, you’ll discover two USB three.0 ports (one may also be used as a charging port), a Micro SIM slot, safety cable slot and the energy button. On each side of the chassis are vents for cooling, helping to hold the HP ZBook Studio x360 cool beneath heavy workloads.

whereas the community connection requires an RJ–forty five dongle, you might also wish to think about getting HP’s Thunderbolt dock to make connecting to a network connection and screens a quick and simple project. The device comes with a 150-Watt smart/quickly charger and a variety of wire in case your wall socket is not correct next to your desk. All-in-all, the ZBook Studio x360 has the entire connectivity you could possibly require whereas on the road.

requisites

The ZBook Studio x360 as configured cost is $4,243. This comprises an Intel Xeon E – 2186M CPU with six cores and 12 threads, together with a 12 MB cache working at 2.9GHz and a lift of up to 4.8GHz. There are 32GB of DDR ECC 2666MHz RAM and a 1TB solid-state NVMe SSD. you can improve to 64GB of RAM and a whopping 6TB of inner storage.

The reveal is a 15.6-in UHD (3840 x 2160) IPS multi-touch monitor coupled with a NVIDIA Quadro P1000 card with 4GB of reminiscence. The Quadro P1000 is a mid-latitude cell laptop portraits card in response to NVIDIA’s Pascal architecture, providing a stability between price and performance.

The Entry stage ZBook Studio x360, at $1,999, is outfitted with an 8th Gen Intel Core i5 and windows 10 professional. Of course, you could personalize your device to add greater memory and storage. There are further fashions starting at $2,699 along with the 8th Gen Intel Core i7 and home windows 10 seasoned, ranging up to $5,597, with an Intel Core i9-8950HK processor and HP’s 4K Dreamcolor reveal working home windows 10 seasoned.

putting off the back cover reveals all the user upgradable add-ons. This offers entry to 2 M.2 strong state power slots. This system came configured with 32GB of reminiscence on one module, but which you could improve at purchase time to 64GB.

Battery lifestyles

The ZBook Studio x360is geared up with an 11.55 Volt, 7965 mAh battery that, in keeping with HP, can provide the desktop with as much as 14 hours of battery time. In my battery check, using handiest the dedicated P1000 graphics alternative, working full brightness and playing full-display 1080P video, i used to be able to get simply over six hours of runtime.

making an attempt to get the highest time out of the battery, I changed to the hybrid pix mode and reduced the display brightness to 25 %. whereas surfing the cyber web and reading documents, I managed to squeeze a little more than 9 hours and 57 minutes from the ZBook Studio x360.

digital camera and Sound

The computer also sports an Intel 9560 802.11AC V professional instant-AC adapter, HP’s lt4120 LTE HSPA + Gobi 4G, together with Bluetooth 5.0 aid. The constructed-in digital camera is a 720p HD digital camera with a built-in microphone, together with a front-facing microphone for both convention calls or advanced noise cancelation.

Sound is emitted from 4 Bang & Olufson speakers, two installed just above the keyboard, and two established towards the front of the base and out the sides into the desk. These are loud ample to use in a small area and sound exquisite when staring at motion pictures or listening to your favourite music. This turned into a true standout for this computing device. For the most beneficial adventure even though, plug in a group of headphones and use the available Dolby Atmos feature.

The screen

The 15.6-in panel is a UHD (3840 x 2160) IPS contact display with HDR potential and a specified brightness of four hundred nits. the use of the Datacolor Spyder 5 Elite display screen calibration device, I measured an ordinary of 381.7 nits at 100% brightness, with a black degree of 0.34 nits, giving a 1140:1 contrast ratio. The screen is wonderful when working internal under managed lighting fixtures, with a large viewing perspective and abundant brightness for general use. When engaged on my deck on a sunny day, youngsters, the reflection on the display, coupled with the maximum brightness, made it complicated to see.

The HDR monitor in fact shines when it involves colour fine. After testing each the sRGB and Adobe RGB color spaces, the ZBook Studio x360 screen become best able to reveal 98 p.c of the sRGB and 76 % of the AdobeRGB colour areas. having said that, gazing one of my favorite Netflix 4K HDR movies, Planet Earth II, on this display become actually a pleasure. The shades of the jungle and barren region were wealthy and pure. Even the tiniest particulars, like the particular person green leaves within the mangrove, stood out crisp and clear.

When it involves brightness or luminance uniformity, shows are likely to differ as a result of adaptations in manufacturing and dealing with. At 100 percent brightness, this computer’s screen suggests a edition from a vivid 381.5 nits (or cd/m2), down to a low of 359.6 nits, a 6 p.c change in luminance.

in terms of color accuracy, the display fared smartly straight out-of-the-field and not using a color correction introduced. With an average Delta-E of two.22, the colour representation to the bare eye appears miraculous.

performance and Benchmarks

Boasting a 6-core/12-thread Intel Xeon E-2186M coffee Lake processor operating at 2.9GHz, the ZBook Studio x360 with 32GB of RAM confirmed it has what it takes to be a powerful competitor in a crowded field. After running the ordinary battery of benchmarks, the computing device got outcomes I anticipated in a device with these requirements. Working in programs like Inventor and Fusion 360 on the ZBook Studio x360 was clean and what I expected from a notebook-type computing device.

ratings

beginning with a standard multi-core Cinebench 15 ranking of 1144 capacity the ZBook Studio x360 is no slouch when it involves compute-heavy rendering tasks. This ranking is within the center of the pack in terms of raw multi-core processing but about what is anticipated of an Intel Xeon E-2186M processor. The Xeon processor definitely excels with its single core CPU ranking of 198.

A run of Geekbench four.1 confirmed a single CPU ranking of 5537 and a multi-CPU rating of 22370. once more showing the ZBook Studio x360 coming in correct the place the Intel Xeon E-2186M processor continuously sits.

With an average Passmark rating of 5752, the ZBook Studio x360 ranks within the 96th percentile of laptop systems in its classification.

under all of it, the ZBook Studio x360 is a magnificent computer with ample memory and CPU vigour. operating the SPEC series of benchmarks reveal fairly an awful lot the equal as other benchmarks. the two.9GHz Intel Xeon processor excels at single thread approaches, but the benchmark speed indicates it doesn’t compete with different, quicker multi-core processors. while the NVIDIA P1000 is a gorgeous photos alternative, I discover it a bit underpowered for this stage of notebook. As shown by way of the breakdown of the SPECworkstation three and SPECviewperf 13 consequences, here is a laptop category computing device.

Conclusion

The ZBook Studio x360 is a stylish, lightweight and versatile addition to HP’s ever-becoming catalog of moveable workstations. It stands out from the crowded container by being anything for nearly each person in need of an expert portable gadget. It does this with its fascinating 4K UHD contact-reveal monitor, which doubles as a pen tablet for artists, and strong Xeon processor. a big number of I/O ports and easy entry to additional storage expansion add to the mix.

When it comes to design, the HP ZBook Studio x360 is without difficulty one in all my favorites. regardless of a few minor considerations with monitor reflection and brightness, its daring styling and convertible design push the HP ZBook Studio x360 near the desirable of my checklist of portable workstations.


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Designing and Implementing HP SAN(R) Solutions

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Union Bank’s San Diego Headquarters Building Awarded Leed(R) Gold Certification | killexams.com real questions and Pass4sure dumps

SAN DIEGO, Sep. 22 /CSRwire/ - Union Bank's San Diego headquarters building located at 530 B Street has been awarded LEED® Gold certification from the Green Building Certification Institute under the standards established by the U.S. Green Building Council. Gold status was awarded to six buildings across the United States in the most recent certification and Union Bank's San Diego headquarters building is one of only two in California.

LEED, which stands for Leadership in Energy and Environmental Design, is the nation's preeminent program for the design, construction, and operation of high-performance green buildings. It provides independent, third-party verification that a building project meets the highest measures of green building and performance.

"We are proud to receive such a prestigious recognition as the LEED Gold certification," said Kathy Breed, vice president in Union Bank’s Environmental Stewardship Department. "This award recognizes our environmental contribution to the San Diego community and reflects our commitment to being a socially responsible organization."

LEED certification of the building was based on a number of green design and construction features and policy changes that positively impact the building, its occupants, and the broader community including:

  • Water Efficiency: Low-flush toilets and low-flow water fixtures were installed reducing water-use by approximately 35 percent, saving 770,000 gallons of water per year.
  • Material Selection: Compact fluorescent bulbs and energy efficient lighting with reduced or no mercury content were installed, which is good for the environment as well as occupant safety.
  • Indoor/Exterior Environmental Quality: A green cleaning program was implemented and only environmentally friendly low-Volatile Organic Compounds may now be used. Policies, procedures, and trainings have been implemented to minimize the impact of cleaning materials on the health of building occupants and protect the environment.
  • The improvements to the facility were implemented by Union Bank's facilities management vendor, Jones Lang LaSalle, a financial and professional services firm specializing in real estate services and investment management.

    "Sustainable operating policies, practices, and energy efficiency improvements that contributed to this certification also align with Union Bank’s corporate commitment to sustainability, and are an important part of our mandate in managing the facilities," said Joy Cole, General Manager of Jones Lang LaSalle. "We see more and more evidence that sustainability in buildings not only reduces operating costs but also fosters enhanced employee well-being and job satisfaction."

    About UnionBanCal Corporation & Union Bank, N.A.Headquartered in San Francisco, UnionBanCal Corporation is a financial holding company with assets of $84 billion at June 30, 2010. Its primary subsidiary, Union Bank, N.A., is a full-service commercial bank providing an array of financial services to individuals, small businesses, middle-market companies, and major corporations. The bank operated 396 banking offices in California, Oregon, Washington and Texas as well as two international offices, on June 30, 2010. UnionBanCal Corporation is a wholly-owned subsidiary of The Bank of Tokyo-Mitsubishi UFJ, Ltd., which is a subsidiary of Mitsubishi UFJ Financial Group, Inc. Union Bank is a proud member of the Mitsubishi UFJ Financial Group (MUFG, NYSE:MTU), one of the world's largest financial organizations. Visit www.unionbank.com for more information.

    About LEEDLEED is an internationally recognized green building certification system, providing third-party verification that a building or community was designed and built using strategies aimed at improving performance across all the metrics that matter most: energy savings, water efficiency, CO2 emissions reduction, improved indoor environmental quality, and stewardship of resources and sensitivity to their impacts.

    Developed by the U.S. Green Building Council (USGBC), LEED provides building owners and operators a concise framework for identifying and implementing practical and measurable green building design, construction, operations and maintenance solutions.


    HP Unveils New 3D Printing Global Reseller Program, Service Bureau ... | killexams.com real questions and Pass4sure dumps

    New customers and partners accelerate global reach and adoption of HP's commercial 3D printing solutions to reinvent manufacturing

    PITTSBURGH, PA--(Marketwired - May 8, 2017) -  HP Inc. (NYSE: HPQ)

    News highlights:

  • Launches new HP 3D printing global reseller program -- the HP Partner First 3D Printing Specialization program -- with more than 30 selected, trained and certified partners to expand availability and delivery of its 3D printing solutions
  • Showcases growing roster of manufacturing service bureaus and product design firms implementing HP Jet Fusion 3D Printing systems for production use and new services
  • Unveils more than a dozen new HP 3D Printing Reference and Experience Centers to enable current and future customers and partners to get hands-on experience with HP Multi Jet Fusion technology
  • Expands its 3D printing materials ecosystem with new partner Henkel AG & Co, an EUR 18B chemical and consumer goods leader 
  • Today at Rapid + TCT, the industry's largest 3D additive manufacturing conference, HP Inc. demonstrated the global momentum of its Jet Fusion 3D Printing solutions as it scales its business to meet rising customer demand. This includes the official unveiling of the new HP Partner First 3D Printing Specialization program, a wide array of installations with manufacturing service bureaus and product design firms in key geographies, and more than a dozen new HP 3D Printing Reference and Experience Centers across the U.S. and Europe.

    HP also announced the addition of Henkel AG & Co. to its open ecosystem for 3D printing materials and applications. HP's Jet Fusion 3D Printing solution is a production-ready commercial 3D printing system that delivers superior1 quality physical parts up to 10 times2 faster and at half the cost3 of current 3D print systems. 

    "Building on our experience of more than 500,000 Multi Jet Fusion-produced parts, we are now scaling our 3D printing business to the next level. Today we are expanding our solutions availability through new resellers and service bureau partners, opening new experiential facilities for customers and partners, and widening our open 3D printing materials ecosystem," said Stephen Nigro, President of 3D Printing, HP Inc. "We are honored that industry-leading companies such as BMW, Jabil, Johnson & Johnson, Nike and dozens more are looking to the innovations and economics delivered by HP and our partners to help reinvent their businesses for the digital manufacturing revolution."

    New HP 3D Printing Reseller Program To meet growing international customer demand, HP formally unveiled its new global reseller program -- the HP Partner First 3D Printing Specialization program -- with more than 30 hand-selected, trained and certified partners. Initially focused on North America and Europe, the program enables leading manufacturing solutions providers to rapidly deliver HP's 3D printing technologies to customers and scale up to meet their needs. Certified HP 3D printing reseller partners will bring best-in-class expertise and knowledge of HP's Multi Jet Fusion technology to customers deploying the solutions, as well as value added services such as the enablement of new applications and industry-leading response time and service quality.

    Partners interested in more information about joining HP's Partner First 3D Printing Specialization program can connect with a local HP team member at https://partner.hp.com/.

    Service Bureaus and Product Design Houses Showcase New HP Jet Fusion-powered 3D Printing Offerings Service bureaus and product design firms are a hallmark of manufacturing innovation, adopting leading-edge technologies ahead of the industry and delivering breakthrough services to their own end-customers. Leaders such as Fast Radius, Forecast3D, Go Proto, Materialise, ProtoCAM, Proto Labs, Shapeways, Sigma Design and 3D Prod are installing HP 3D printing systems and beginning to deliver production quality HP Jet Fusion 3D printed parts. 

    Building on these successful installations, HP is expanding deployments with leading manufacturing service bureaus and design engineering firms across North America and Europe to enable a new class of on-demand, industrial-grade 3D production parts and services. 

    To connect with an HP Jet Fusion-enabled 3D printing service bureau near you visit www.hp.com/go/3Dcontactus

    HP Opens New 3D Printing Reference and Experience Centers HP, in collaboration with numerous partners, is opening more than a dozen 3D Printing Reference and Experience Centers across North America and Europe to enable companies to engage with HP's Jet Fusion 3D Printing solutions in production-level scenarios. Testing and qualification of new 3D printing use-cases will be enabled in controlled environments, providing customers a simpler path to advance from prototyping to full scale 3D production.

    These centers initially include facilities in Allentown, PA; Alpharetta, GA; Carlsbad, CA; Corvallis, OR; Livonia, MI; Louisville, KY; Manchester, CT; Milpitas, CA; Palo Alto, CA; San Diego, CA; and Vancouver, WA in the United States; and Raon-l'Etape, France; Leonberg, Germany; Eindoven, The Netherlands; Barcelona, Spain; and Birmingham, United Kingdom.

    For more information or to schedule a visit to an HP 3D Printing Reference and Experience Center please contact www.hp.com/go/3Dcontactus

    Henkel Joins HP's Open Materials and Applications Platform Henkel joins HP's ecosystem of global materials leaders including Arkema, BASF, Evonik, and Lehmann & Voss, to support HP's Open Platform for 3D printing materials and applications. HP's unique open 3D printing platform model helps expand the availability of new materials and address a broader set of applications, lower materials and development costs, drive speed and performance improvements, and create new possibilities for part properties that address specific industry needs.

    Henkel, a global supplier of high-performance adhesives used in critical applications such as medical device, electronic device, and transportation vehicle assembly, plans to work with HP in its state-of-art Open Materials and Applications Lab in Corvallis, Oregon to expand its broad product range. Henkel is focusing development on providing novel powder materials for use with HP Jet Fusion 3D printers.

    "The partnership between HP and Henkel is backed by strong market leadership, a legacy of innovation, and an aligned commitment to additive manufacturing," said Michael Todd, Corporate Vice President and Global Head of Innovation and New Business Development, Henkel Adhesive Technologies. "With our broad material portfolio and customer base across diverse industries, Henkel is able to champion custom 3D solutions through various functional applications. This, combined with HP's vision for open materials innovation, enables us to develop materials and applications once thought impossible."

    Learn more about becoming a certified HP Open Materials and Applications Platform partner.

    HP at RAPID + TCT

  • Stephen Nigro, President of 3D Printing, HP Inc., will appear on the "Transformation of Manufacturing" keynote panel on May 8, 2017
  • Attendees can learn more about HP's Jet Fusion 3D Printing solutions by visiting Booth #2517. 
  • About HP HP Inc. creates technology that makes life better for everyone, everywhere. Through our portfolio of printers, PCs, mobile devices, solutions and services, we engineer experiences that amaze. More information about HP Inc. is available at http://www.hp.com.

    Forward-Looking Statements This news release contains forward-looking statements that involve risks, uncertainties and assumptions. If the risks or uncertainties ever materialize or the assumptions prove incorrect, the results of HP Inc. and its consolidated subsidiaries ("HP") may differ materially from those expressed or implied by such forward-looking statements and assumptions.

    All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to any projections of net revenue, margins, expenses, effective tax rates, net earnings, net earnings per share, cash flows, benefit plan funding, deferred tax assets, share repurchases, currency exchange rates or other financial items; any projections of the amount, timing or impact of cost savings or restructuring and other charges; any statements of the plans, strategies and objectives of management for future operations, including the execution of restructuring plans and any resulting cost savings, revenue or profitability improvements; any statements concerning the expected development, performance, market share or competitive performance relating to products or services; any statements regarding current or future macroeconomic trends or events and the impact of those trends and events on HP and its financial performance; any statements regarding pending investigations, claims or disputes; any statements of expectation or belief; and any statements of assumptions underlying any of the foregoing.

    Risks, uncertainties and assumptions include the need to address the many challenges facing HP's businesses; the competitive pressures faced by HP's businesses; risks associated with executing HP's strategy; the impact of macroeconomic and geopolitical trends and events; the need to manage third-party suppliers and the distribution of HP's products and the delivery of HP's services effectively; the protection of HP's intellectual property assets, including intellectual property licensed from third parties; risks associated with HP's international operations; the development and transition of new products and services and the enhancement of existing products and services to meet customer needs and respond to emerging technological trends; the execution and performance of contracts by HP and its suppliers, customers, clients and partners; the hiring and retention of key employees; integration and other risks associated with business combination and investment transactions; the results of the restructuring plans, including estimates and assumptions related to the cost (including any possible disruption of HP's business) and the anticipated benefits of the restructuring plans; the resolution of pending investigations, claims and disputes; and other risks that are described in HP's Annual Report on Form 10-K for the fiscal year ended October 31, 2015, HP's Quarterly Reports on Form 10-Q for the fiscal quarters ended January 31, 2016, April 30, 2016 and July 31, 2016, and HP's other filings with the Securities and Exchange Commission. HP assumes no obligation and does not intend to update these forward-looking statements. HP's Investor Relations website at http://www.hp.com/investor/home contains a significant amount of information about HP, including financial and other information for investors. HP encourages investors to visit its website from time to time, as information is updated and new information is posted.

    1 Based on dimensional accuracy of ±0.2 mm/0.008 inches, measured after sand blasting. See hp.com/go/3Dmaterials for more info on materials specifications. Based on the following mechanical properties: Tensile strength at 50, Modulus Z 1900, Modulus XY 1900. ASTM standard tests with PA-12 material.

    2 Based on internal testing and simulation, HP Jet Fusion 3D printing solution average printing time is up to 10x faster than FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Testing variables: Part Quantity -1 full bucket of parts from HP Jet Fusion 3D at 20% of packing density vs same number of parts on above-mentioned competitive devices; Part size: 30g; Layer thickness: 0.1mm/0.004 inches. Fast Cooling is enabled by HP Jet Fusion 3D Processing Station with Fast Cooling, available in 2017. HP Jet Fusion 3D Processing Station with Fast Cooling accelerates parts cooling time vs recommended manufacturer time of SLS printer solutions from $100,000 USD to $300,000 USD, as tested in April 2016. FDM not applicable.

    3 Based on internal testing and public data, HP Jet Fusion 3D printing solution average printing cost-per-part is half the cost of comparable FDM & SLS printer solutions from $100,000 USD to $300,000 USD on market as of April 2016. Cost analysis based on: standard solution configuration price, supplies price, and maintenance costs recommended by manufacturer. Cost criteria: printing 1-2 buckets per day/ 5 days per week over 1 year of 30 grams parts at 10% packing density using the powder reusability ratio recommended by manufacturer.


    National Academy of Engineering elects 104 Members | killexams.com real questions and Pass4sure dumps

    Business News of Saturday, 9 February 2019

    Source: citinewsroom.com

    2019-02-09

    The National Academy of Engineering (NAE) has elected 86 new members and 18 foreign members, announced NAE President C. D. (Dan) Mote, Jr., today.

    This brings the total U.S. membership to 2,297 and the number of foreign members to 272.

    The election to the National Academy of Engineering is among the highest professional distinctions accorded to an engineer.

    Academy membership honors those who have made outstanding contributions to “engineering research, practice, or education, including, where appropriate, significant contributions to the engineering literature” and to “the pioneering of new and developing fields of technology, making major advancements in traditional fields of engineering, or developing/implementing innovative approaches to engineering education.”

    Individuals in the newly elected class will be formally inducted during a ceremony at the NAE’s annual meeting in Washington, D.C., on Oct. 6, 2019.

    A list of the newly elected members and foreign members follows, with their primary affiliations at the time of election and a brief statement of their principal engineering accomplishments.

    Below is the list of new members

    Agonafer, Dereje, Jenkins Garrett Professor and director, mechanical and aerospace engineering department, University of Texas, Arlington. For contributions to computer-aided electro/thermo/mechanical design and modeling of electronic equipment.

    Ahuja, Krishan K., Regents Professor, Daniel Guggenheim School of Aerospace Engineering, Georgia Tech, Atlanta. For the development of quieter aerosystems and contributions to aeroacoustics research, literature, and education.

    Aizenberg, Joanna, Amy Smith Berylson Professor of Materials Science and professor of chemistry and chemical biology, School of Engineering, Harvard University, Cambridge, Mass. For contributions to understanding of biological systems and bioinspired materials design.

    Antonsson, Erik K., president and chief executive officer, aiPod Inc., Pasadena, Calif. For leadership in the development of aerospace/defense systems, formal methods of engineering design, and active learning in engineering education.

    Axelrad, Penina, Joseph T. Negler Professor, Ann and H.J. Smead Aerospace Engineering Sciences, University of Colorado, Boulder. For application of multipath GPS signals to improve satellite navigation and new approaches to remote sensing.

    Baker, Mary, chairman and president, ATA Engineering Inc., San Diego. For computer simulation methods for structural mechanics problems and engineering leadership.

    Balta, Wayne S., vice president, corporate environmental affairs and product safety, IBM Corp., Armonk, N.Y. For advancing corporate environmental sustainability practices worldwide.

    Barabino, Gilda A., Daniel and Frances Berg Professor and dean, Grove School of Engineering, City College of New York, New York City. For leadership in bioengineering research and inclusive models of bioengineering education and faculty mentoring.

    Barrangou, Rodolphe, Todd R. Klaenhammer Distinguished Scholar in Probiotics Research, and professor, food, bioprocessing, and nutrition science, North Carolina State University, Raleigh. For discovery of CRISPR-Cas genome editing and engineering microbes, plants, and animals for food and other applications.

    Barros, Ana P., James L. Meriam Professor of Civil and Environmental Engineering, Duke University, Durham, N.C. For contributions to understanding and prediction of precipitation dynamics and flood hazards in mountainous terrains.

    Benioff, Marc R., chairman and co-chief executive officer, Salesforce, San Francisco. For leadership in cloud computing and corporate philanthropy.

    Bishop, David J., director, CELL-MET Engineering Research Center, and head, division of materials science and engineering, Boston University, Boston. For contributions and leadership in high-capacity optical switch technology.

    Biswas, Pratim, Stanley and Lucy Lopata Professor and chair, department of energy, environmental, and chemical engineering, Washington University, St. Louis. For advancing the science of aerosol dynamics and particle removal technologies.

    Braatz, Richard D., Edwin R. Gilliland Professor of Chemical Engineering, chemical engineering department, Massachusetts Institute of Technology, Cambridge. For contributions to diagnosis and control of large-scale and molecular processes for materials, microelectronics, and pharmaceuticals manufacturing.

    Broadbelt, Linda J., Sarah Rebecca Roland Professor, department of chemical and biological engineering, Northwestern University, Evanston, Ill. For contributions to complex kinetic modeling, particularly for understanding the pathways by which hydrocarbons and polymers undergo pyrolysis.

    Chen, Wei, Wilson-Cook Professor in Engineering Design and professor of mechanical engineering, Northwestern University, Evanston, Ill. For contributions to design under uncertainty in products and systems, and leadership in the engineering design community.

    Clark, Douglas S., dean, College of Chemistry, and professor of chemical and biomolecular engineering, University of California, Berkeley. For advances in biocatalyst and bioreaction engineering for drug discovery, drug screening, and bioprocessing.

    Conger IV, Harry M. “Red,” president and chief operating officer, Americas, Freeport-McMoRan Inc., Phoenix. For contributions to copper mine/plant design and leadership of Freeport to become the world’s top private copper producer.

    Deisseroth, Karl, D.H. Chen Professor, bioengineering and psychiatry and behavioral sciences, Stanford University and Howard Hughes Medical Institute, Stanford, Calif. For molecular and optical tools for discovery and control of neuronal signals behind animal behavior in health and disease.

    Deligianni, Hariklia, retired research scientist, IBM Corp., Tenafly, N.J. For electrochemical processes used by major microelectronic chip producers worldwide.

    Eccles, Thomas J., rear admiral, U.S. Navy (retired), and chief executive officer, Trident Maritime Systems, Arlington, Va. For service in naval engineering and advances in submarine technology.

    England, Paul, director, Microsoft Research, Redmond, Wash. For defining the hardware foundations of secure computing, Trusted Platform Module, and secure enclaves, and for conceiving the darknet.

    Erdemir, Ali, Distinguished Fellow and program lead, materials for harsh conditions, applied materials division, Argonne National Laboratory, Argonne Ill. For contributions to the science and technology of friction, lubrication, and wear.

    Fascetti, Robert J., retired vice president, global powertrain engineering, Ford Motor Co., Bloomfield Hills, Mich. For leadership in powertrain products with improved fuel economy, superior performance, and reduced greenhouse gas emissions.

    Gallimore, Alec D., Robert J. Vlasic Dean of Engineering and professor, University of Michigan, Ann Arbor. For advanced spacecraft electric propulsion, especially Hall thruster technology.

    Glotzer, Sharon C., Anthony C. Lembke Department Chair of Chemical Engineering and professor, University of Michigan, Ann Arbor. For development of computer-based design principles for assembly engineering and manufacturing of advanced materials and nanotechnology.

    Grejner-Brzezinska, Dorota A., Lowber B. Strange Endowed Professor and chair, civil, environmental, and geodetic engineering, Ohio State University, Columbus. For contributions to geodetic science and satellite navigation, including integration with artificial intelligence.

    Halpern, Joseph Y., Joseph C. Ford Professor of Engineering, computer science department, Cornell University, Ithaca, N.Y. For methods of reasoning about knowledge, belief, and uncertainty and their applications to distributed computing and multiagent systems.

    Hassan, Yassin A., Sallie and Don Davis ’61 Professor in Engineering, departments of nuclear engineering and mechanical engineering, Texas A&M University, College Station. For experimentally validated thermal hydraulic analyses of multiphase flow fields for nuclear reactor operations.

    Heritage, Jonathan P., professor emeritus, department of electrical and computer engineering, University of California, Davis. For contributions to optical pulse shaping and wavelength selective optical switches.

    Hudson, Linda P., chairman and chief executive officer, The Cardea Group, Charlotte, N.C. For leadership in development and production of military systems, and for mentoring and developing future engineering leaders.

    Ingebritsen, Steven E., research hydrologist, U.S. Geological Survey, U.S. Department of Interior, Menlo Park, Calif. For contributions to understanding the role of groundwater in geologic processes.

    Jordan, William C., principal, Jordan Analytics LLC, Beverly Hills, Mich. For development of analytic methods to improve manufacturing systems and for quantitative analysis of future mobility systems.

    Katz, Joseph, William F. Ward Sr. Distinguished Professor, department of mechanical engineering, Johns Hopkins University, Baltimore. For development of optical methods in experimental fluid mechanics for turbomachinery, cavitation, turbulence, and environmental flows.

    Khoshnevis, Behrokh, president and chief executive officer, Contour Crafting Corp., El Segundo, Calif. For innovations in manufacturing and construction, including the application of 3D printing methods.

    Kiesler, Sara, program director, division of social and economic sciences, National Science Foundation, Alexandria, Va. For leadership, technical innovation, and identification of social trends with the adoption of computers and robots in work and society.

    Kircher, Charles A., principal, Kircher & Associates, Palo Alto, Calif. For advancing structural engineering practice in earthquake engineering and loss prevention in building design.

    Kiss, Robert, vice president, process and analytical development, Sutro Biopharma Inc., South San Francisco. For contributions to mammalian cell culture and microbial processes that produce recombinant proteins and antibodies.

    Kogel, Jessica E., associate director for mining, National Institute for Occupational Safety and Health, Atlanta. For sustainable development and innovation of industrial clay products and processes.

    Koon, John H., president, John H. Koon & Associates, Atlanta. For contributions to the design of systems to treat chemically complex industrial wastewaters.

    Kuehmann, Charles J., vice president of materials engineering, SpaceX and Tesla Motors, Palo Alto, Calif. For contributions to the creation and commercialization of computational materials design.

    Kumar, Anil, associate fellow, specialty coatings and materials, PPG, Monroeville, Pa. For contributions in photochromism and variable polarization and leadership in commercialization.

    Lam, Monica S., professor, computer science department, Stanford University, Stanford, Calif. For contributions to the design of advanced compiler and analysis systems for high-performance computers.

    Lievense, Jefferson C., senior adviser to the chief executive officer, bioengineering and technology, Genomatica Inc., San Diego. For leadership in biomanufacturing of sustainable chemicals.

    *Lorenz, Robert D., Elmer and Janet Kaiser Chair and Consolidated Papers Professor of Controls Engineering, department of mechanical engineering, University of Wisconsin, Madison. For contributions to modeling and control of cross-coupled electromechanical systems for high-performance electric machines and drives.

    McCarthy, Kathryn A., vice president, research and development, Canadian Nuclear Laboratories, Chalk River, Ontario, Canada. For leadership in research and data analysis in support of licensing extensions for light water nuclear reactors.

    McGill, Laura J., vice president, engineering, Raytheon Missile Systems, Tucson, Ariz. For technical leadership of missile systems for the United States and its allies.

    McKinley, Gareth H., mechanical engineering department, School of Engineering Professor of Teaching Innovation, Massachusetts Institute of Technology, Cambridge. For contributions in rheology, understanding of complex fluid dynamical instabilities, and interfacial engineering of super-repellent textured surfaces.

    Moghaddam, Mahta, William M. Hogue Professorship in Electrical Engineering and professor of electrical engineering-electrophysics, University of Southern California, Los Angeles. For development of physics-based computational algorithms for mapping of subsurface characteristics.

    Mokhtari, Sasan, president and chief executive officer, Open Access Technology International Inc., Minneapolis. For development of software for web-based electric power transmission access, including tagging and scheduling. Morel, Thomas A., president, Gamma Technologies Inc., Westmont, Ill. For development of computeraided engineering tools for engines and vehicles.

    Morris, Robert T., professor, Computer Science and Artificial Intelligence Laboratory, Massachusetts Institute of Technology, Cambridge. For contributions to programmable network routers, wireless mesh networks, and networked computer systems.

    Moyer, Mary Pat, founder, chief executive officer, and chief science officer, INCELL Corp. LLC, San Antonio. For entrepreneurship and development of cell lines, cell media, and testing technologies for regenerative medicine and biopharma products.

    Nunes, Sharon L., retired vice president, smarter cities and big green innovations, IBM Corp., Falmouth, Mass. For corporate leadership in development of next-generation green technologies, focusing on novel materials and processes.

    O’Sullivan, Stephanie L., consultant and retired principal deputy director, U.S. Office of the Director of National Intelligence, Duck Key, Fla. For science, technology, and leadership in national security.

    Picard, Rosalind, professor and director of affective computing research, Media Lab, Massachusetts Institute of Technology, Cambridge. For contributions to effective and wearable computing.

    Pines, Darryll J., professor and dean, A. James Clark School of Engineering, University of Maryland, College Park. For inspirational leadership and contributions to engineering education excellence in the United States.

    Prather, Kimberly A., Distinguished Chair in Atmospheric Chemistry, department of chemistry and biochemistry and Scripps Institution of Oceanography, University of California, San Diego, La Jolla, Calif. For technologies that transformed understanding of aerosols and their impacts on air quality, climate, and human health.

    Reid, John, director, product technology and innovation, Moline Technology Innovation Center, John Deere, Moline, Ill. For innovation in automation technologies for agricultural systems.

    Samuel, Clifford M., senior vice president, access operations and emerging markets, Gilead Sciences Inc., Foster City, Calif. For innovations in supply chain management and manufacturing technologies central to delivering medication in developing countries.

    San Martin, A. Miguel, chief engineer, guidance, navigation, and control, Jet Propulsion Laboratory, Pasadena, Calif. For technical contributions and leadership in guidance, navigation, and control leading to successful Mars entry, descent, and landing.

    Sarter, Nadine B., professor, industrial and operations engineering, University of Michigan, Ann Arbor. For innovation in the design and use of tactile displays for improved safety in aviation, automobiles, and health care.

    Schuh, Christopher A., department head and professor, materials science and engineering, Massachusetts Institute of Technology, Cambridge. For contributions to design science and application of nanocrystalline metals.

    Scott, Robert A., vice president, technology transfer, surgical research and development, Alcon, Lake Forest, Calif. For contributions in ophthalmological biomaterials for intraocular lenses, glaucoma implants, and surgical equipment.

    Seltzer, Margo I., Herchel Smith Professor of Computer Science, School of Engineering and Applied Science, Harvard University, Cambridge, Mass. For engineering contributions to databases, file systems, and operating systems.

    Semiatin, Sheldon Lee, senior scientist, materials/processing science and research leader, Metals Processing Group, Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio. For contributions to thermomechanical processing of aerospace alloys and emerging intermetallic materials.

    Shanahan, Patrick M., acting secretary, U.S. Department of Defense, Washington, D.C. For aerospace industry leadership in commercial aircraft, missile defense, and rotorcraft and for service to the Department of Defense.

    Shoop, Barry L., dean and professor of electrical engineering, Albert Nerken School of Engineering, The Cooper Union, New York City. For leadership in developing engineering systems solutions for national security and contributions to military engineering education.

    Shyu, Heidi, president and chief executive officer, Heidi Shyu Inc., Arlington, Va. For development of innovative radar/electro-optics/infrared systems in support of the U.S. Army and Air Force.

    Sigur, Wanda A., retired vice president and deputy general manager, civil space, Lockheed Martin Corp., Seabrook, Texas. For contributions to human spaceflight exploration systems.

    Smith, Jane McKee, senior research scientist for hydrodynamic phenomena, Engineering Research and Development Center, U.S. Army Corps of Engineers, Vicksburg, Miss. For leadership in coastal engineering research and development resulting in improved infrastructure resilience.

    Speer, John G., John Henry Moore Distinguished Professor and director, Advanced Steel Processing and Products Research Center, Colorado School of Mines, Golden. For the conception, invention, and reduction to practice of quenching and partitioning steel.

    Stanney, Kay M., president and founder, Design Interactive Inc., Orlando, Fla. For contributions to human factors engineering through virtual reality technology and strategic leadership.

    Stein, Robert M., consultant, Brookline, Mass. For contributions to electronic systems for national security applications.

    Stephens, Daniel B., chairman of the board and principal hydrologist, Daniel B. Stephens & Associates Inc., Albuquerque, N.M. For innovations in vadose zone hydrologic practice and theory.

    Tabors, Richard, president, Tabors Caramanis Rudkevich, Boston. For development of technologies for real-time locational pricing of electricity for reduced electric transmission congestion.

    Tarokh, Vahid, Rhodes Family Professor of Electrical and Computer Engineering, Duke University, Durham, N.C. For contributions to space-time coding and its applications to multi-antenna wireless communications.

    Thapar, Hemant K., chairman and chief executive officer, OmniTier Inc., Milpitas, Calif. For contributions to theory and practice of coding and signal processing for high-density magnetic recording.

    Tom, Jean W., group director, process research and development, Bristol-Myers Squibb, New Brunswick, N.J. For leadership in the process development of multiple commercialized drugs.

    Tomlin, Claire J., Charles A. Desoer Chair and professor, electrical engineering and computer sciences, University of California, Berkeley. For contributions to design tools for safety-focused control of cyberphysical systems.

    Trolier-McKinstry, Susan, professor of ceramic science and engineering, Pennsylvania State University, University Park. For development of thin film multilayer ceramic capacitors and piezoelectric microelectromechanical systems.

    Tsividis, Yannis, Edwin Howard Armstrong Professor of Electrical Engineering, Columbia University, New York City. For contributions to analog and mixed-signal integrated circuit technology and engineering education.

    Udren, Eric A., executive adviser, Quanta Technologies, Raleigh, N.C. For leadership in advancing protection technologies for electric power grids.

    Vaidyanathan, P.P., Kiyo and Eiko Tomiyasu Professor of Electrical Engineering, California Institute of Technology, Pasadena. For contributions to digital filter bank theory and design.

    Wang, Christine A., senior staff scientist, Laser Technology and Applications Group, MIT Lincoln Laboratory, Lexington, Mass. For contributions to epitaxial crystal growth of III-V compound semiconductors and design of organometallic vapor-phase epitaxy reactors.

    Wu, Margaret M., retired senior scientific adviser, ExxonMobil Research and Engineering Co., Odenton, Md. For contributions to synthetic lubricants for improved energy efficiency and machine protection.

    Elected posthumously New Foreign Members Bétin, Pierre Claude, retired senior vice president, Safran S.A./SNECMA, Villenave d’Ornon, France. For leadership of Europe’s solid rocket propulsion industry and contributions to launch and missile systems.

    Brignole, Esteban A., professor emeritus, chemical engineering, Universidad Nacional Sur/CONICET, Bahia Blanca, Argentina. For contributions to molecular design of solvents, modeling of high-pressure phase equilibria, and leadership in research and academic-industry collaborations.

    Cates, Michael E., Lucasian Professor of Mathematics and Royal Society Research Professor, department of applied mathematics and theoretical physics, University of Cambridge, Cambridge, United Kingdom. For research on the rheology, dynamics, and thermodynamics of complex fluids, and for scientific leadership in the European Community.

    de Geus, Aart J., chairman and co-chief executive officer, Synopsys Inc., Mountain View, Calif. For leadership and technical contributions to logic synthesis for integrated circuits.

    Dordain, Jean-Jacques, consultant and former director general, European Space Agency, Paris. For contributions to complex space systems and leadership of space exploration programs worldwide.

    Dyson, James, chairman and founder, Dyson Technology Ltd., Malmesbury, Wiltshire, United Kingdom. For development of advanced technologies and innovative products and for contributions to design and engineering education.

    Jonah, Samuel E., executive chairman, Jonah Capital, Accra, Ghana. For leadership and technical contributions in advancing the mineral industry in Africa.

    Laporte, Gilbert, Canada Research Chair in Distribution Management and professor, department of decision sciences, HEC Montréal, Montréal, Canada. For domain-defining contributions to the theory and practice of vehicle routing, facility location, and distribution management.

    Mair, Robert, emeritus professor of civil engineering and director of research, University of Cambridge, Cambridge, United Kingdom. For contributions to underground construction and smart infrastructure and for leadership in government, engineering practice, research, and education.

    Mazumdar-Shaw, Kiran, chairperson and managing director, Biocon Limited, Bangalore, India. For development of affordable biopharmaceuticals and the biotechnology industry in India.

    Murray, Christopher B., Richard Perry University Professor of Chemistry and Materials Science Engineering, University of Pennsylvania, Philadelphia. For invention and development of solvothermal synthesis of monodisperse nanocrystal quantum dots for displays, photovoltaics, and memory.

    Qu, Jiuhui, professor, Research Center for Eco-environmental Sciences, Chinese Academy of Sciences, Beijing. For development of water treatment technology and leadership in improving water quality in China.

    Ramamoorty, Mylavarapu, former chancellor, K L University, Vijayawada, Nacharam, Hyderabad, India. For technical leadership of power engineering research, development, education, and establishing national laboratories in India.

    Rudnick, Hugh, emeritus professor, electrical engineering, Pontificia Universidad Católica de Chile, Santiago, Chile. For leadership in South American electric power markets, resource and transmission planning, and standards. Sohrabpour, Saeed, professor, mechanical engineering, Sharif University of Technology, Tehran, Iran. For establishing Sharif University as an academic Center of Excellence and advancing engineering and science education in Iran.

    Spaldin, Nicola A., professor for materials theory, ETH Zürich, Zürich. For theoretical contributions to advance the field of multiferroics.

    Stevens, Molly, professor of biomedical materials and regenerative medicine, Imperial College – London, South Kensington, United Kingdom. For contributions to materials-based approaches for tissue regeneration and biosensing.

    Zheludev, Nikolay, head of nanophotonics and metamaterials, Optoelectronics Research Centre, University of Southampton, Southampton, United Kingdom. For leadership and technical contributions to optical metamaterials and nanophotonics.



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