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00M-605 IBM Automotive Industry Solutions Sales(R) Mastery Test v1

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00M-605 exam Dumps Source : IBM Automotive Industry Solutions Sales(R) Mastery Test v1

Test Code : 00M-605
Test Name : IBM Automotive Industry Solutions Sales(R) Mastery Test v1
Vendor Name : IBM
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IBM IBM Automotive Industry Solutions

IBM Watson Now obtainable any place | killexams.com Real Questions and Pass4sure dumps

SAN FRANCISCO, Feb. 12, 2019 /PRNewswire/ -- IBM think -- IBM (NYSE: IBM) today announced a brand new chapter in the journey from AI experimentation to huge-scale deployment and business transformation. IBM has made Watson moveable throughout any cloud and empowered groups to steer clear of supplier lock-in and start deploying AI anywhere their statistics resides.

"businesses have mostly been constrained to experimenting with AI in siloes because of the boundaries brought about by means of cloud company lock-in of their facts," said Rob Thomas, accepted manager, IBM statistics and AI. "With most colossal companies storing facts across hybrid cloud environments, they want the freedom and selection to apply AI to their facts at any place it's kept. through breaking open that siloed infrastructure we will assist organizations accelerate their transformation through AI."

Watson, IBM's AI, is designed to help businesses put AI to work to improve the efficiency of enterprise. With a transparent set of purposes, construction tools, computing device getting to know fashions, and management functions, Watson is assisting agencies all over mine their information, predict consequences, and automate time- and resource-sensitive approaches.

modern-day announcements strengthen this mission through offering groups with a less complicated, quicker option to build, installation and run AI models and applications throughout any cloud. With these equipment in location, corporations can:

  • Run IBM Watson services, together with Watson Assistant and Watson OpenScale, on any cloud. via their integration with IBM Cloud inner most for data (ICP for data), Watson and Watson OpenScale can now be run any environment – on premises, or on any deepest, public or hybrid-multicloud – enabling agencies to apply AI to data wherever it's hosted. corporations will be able to infuse AI into their apps, even with the place they live. the flexibleness this affords can get rid of one of the crucial major obstacles to scaling AI, seeing that organizations can now depart facts in comfy or preferred environments and take Watson to that records.
  • installation AI software that automates company processes for more suitable efficiencies and efficiency. New AI digital automation application is designed to permit customers to find patterns of their enterprise techniques and then create AI-embedded programs to automate certain workflows.
  • although using AI continues to gain attention in company, many organizations are still challenged to circulation projects ahead. in keeping with an MIT Sloan report, 81 percent1 of enterprises don't be aware what facts is required for AI, or a way to access it. And a contemporary Gartner study2 found that, "data and analytics leaders proceed to fight with the complexity, time to integration and price implications of their records integration projects, thereby inflating their schedules and birth costs with distinctive cycles of revised mission scope."

    nevertheless, the huge majority of organisations, 83 p.c, according to the MIT Sloan report, agree that riding AI across the enterprise is a strategic chance.

    Qatar building bank has collaborated with IBM to establish the IBM Innovation Hub Doha. some of the key technologies that the Hub will set up is IBM Cloud deepest for statistics. "The enjoyable aspect about IBM Cloud private for information is how rapidly we can be in a position to pressure new improvements in FinTech and SportsTech the use of the microservices in the platform," observed Abdulaziz Al Khalifa, CEO, Qatar building bank. "What makes it mainly attractive is that it allows us to enhance and set up new fashions right now that brings the tools to the statistics, in place of the wrong way round."

    ICP for facts is IBM's open, cloud-native assistance structure for AI that comes built-in with advanced records science, information engineering and software-building capabilities, and is designed to aid companies uncover in the past unobtainable insights from their statistics. Openness is on the core of ICP for facts, for which Watson Studio is a key part. as an example, in keeping with interior analyze, eighty five% of Watson clients are the usage of open supply languages and frameworks like Python, R, and TensorFlow, in the Watson household.three

    In its fresh file, The Forrester Wave™ : commercial enterprise insight systems, Q1 2019, Forrester research named ICP for records a "chief." The report analyzes and studies business perception systems that mix statistics management, analytics, and insight application building tooling. in the study, Forrester stated: "IBM has pre-built-in capabilities that enable customers to be productive in per week or less. We were also impressed with its ML-assisted information cataloging and governance tools. IBM's platform makes use of Kubernetes to installation on-premises or into the general public cloud."

    Watson involves ICP for DataAt the coronary heart of state-of-the-art announcements is a series of latest Watson microservices constructed for ICP for records which are in line with open source technologies and easily scalable across cloud environments. in response to the open-source Kubernetes know-how, these new Watson microservices can also be run on IBM Cloud, and other public, hybrid or multi-cloud environments.

    The microservices are in keeping with here application solutions:

  • Watson OpenScale: IBM's open AI platform for managing distinctive instances of AI, no depend where they have been developed – together with the skill to explain how AI decisions are being made in real time, for more desirable transparency and compliance.
  • Watson Assistant: IBM's AI device for constructing conversational interfaces into purposes and instruments. greater superior than a standard chatbot, Watson Assistant intelligently determines when to search for a outcomes, when to ask the person for clarification, and when to offload the user to a human for personal assistance. furthermore, the Watson Assistant Discovery Extension permits groups to unencumber hidden insights in unstructured statistics and files.
  • the brand new Watson capabilities join Watson Studio and Watson machine getting to know, among different features, which are at the moment available on ICP for information. Later this 12 months, IBM will convey extra Watson capabilities to ICP for data, including Watson advantage Studio and Watson natural Language figuring out.

    in addition to this news, IBM today also introduced that IBM Watson computer studying is being prolonged with a brand new Accelerator (Watson desktop studying Accelerator) that allows high efficiency GPU clustering on vigour methods and X86 programs. mixed with IBM POWER9's industry-main GPU memory bandwidth, the solution can offer up to 10x faster4 laptop researching practicing than competitive options. that you could study extra about the benchmark here.

    IBM company Automation Intelligence with WatsonIn addition to the free up of these options, IBM announced a drawing close utility capacity, called IBM company Automation Intelligence with Watson. With this new utility, business leaders could be able to observe AI without delay to applications, helping to fortify their personnel, from clerical to talents laborers, to intelligently automate work from the mundane to the complex. furthermore, the utility will measure the degree of affect and effectiveness of AI on company consequences.

    IBM enterprise Automation Intelligence with Watson is expected to be attainable later this 12 months. in the meantime, for greater suggestions, seek advice from our early entry software IBM.biz/GoAutomate.

    About IBM & synthetic Intelligence an international chief in AI for company, IBM has deployed Watson options in hundreds of engagements with valued clientele across 20 industries and 80 international locations. IBM's Watson solutions are regularly occurring in industries, including with the aid of 7 of the ten biggest automobile groups and 8 of the ten biggest oil and fuel groups. moreover, IBM research is a global leader in the science of AI. In 2018, IBM secured 1,600 AI-linked patents. And, IBM currently published its main-edge mission Debater, created by using IBM analysis scientists.

    suppose 2019At consider 2019, IBM will define new offerings, customer engagements, partnerships, expertise breakthroughs and developer tools that underscore how IBM and partners are altering the manner the area works.  For more suggestions, seek advice from the IBM believe 2019 Newsroom: https://newsroom.ibm.com/suppose. comply with the convention on Twitter at #think2019 and @ibmlive, and go to https://www.ibm.com/routine/think/ for the whole time table and are living streaming agenda.

    ahead-searching and Cautionary StatementsExcept for the ancient tips and discussions contained herein, statements contained in this free up might also represent ahead-searching statements in the that means of the private Securities Litigation Reform Act of 1995. forward-searching statements are in keeping with the business's present assumptions involving future enterprise and financial efficiency. These statements contain a few hazards, uncertainties and other components that might trigger specific results to differ materially, including here: a downturn in financial ambiance and client spending budgets; the business's failure to satisfy increase and productiveness targets; a failure of the business's innovation initiatives; harm to the company's reputation; dangers from investing in increase opportunities; failure of the company's highbrow property portfolio to prevent competitive choices and the failure of the enterprise to achieve imperative licenses; cybersecurity and information privateness concerns; fluctuations in monetary consequences, influence of native criminal, financial, political and fitness situations; antagonistic effects from environmental concerns, tax matters and the enterprise's pension plans; ineffective inner controls; the company's use of accounting estimates; the business's capability to appeal to and continue key personnel and its reliance on important potential; impacts of relationships with crucial suppliers; product first-rate issues; impacts of business with govt shoppers; forex fluctuations and customer financing dangers; have an impact on of alterations in market liquidity situations and customer credit chance on receivables; reliance on third birthday party distribution channels and ecosystems; the company's potential to effectively manipulate acquisitions, alliances and tendencies; dangers from prison court cases; possibility factors involving IBM securities; and different hazards, uncertainties and components discussed in the business's form 10-Qs, form 10-okay and in the business's other filings with the U.S. Securities and trade fee (SEC) or in substances integrated therein by reference. Any ahead-searching statement in this unencumber speaks simplest as of the date on which it is made. The company assumes no responsibility to replace or revise any ahead-searching statements.

    ContactMichael Zimmerman IBM Media family members (585) 698-9974mrzimmerman@us.ibm.com 

    1 MIT Sloan administration overview, Reshaping business with synthetic Intelligence2 Gartner: "Predicts 2019: statistics administration options," Dec. 6, 2018.3 IBM interior analyze, Feb. 6, 2019.four IBM methods blog: New Watson laptop discovering Accelerator for vigour programs

    supply IBM

    connected links

    http://www.ibm.com


    IBM Watson Assistant Continues to drive global business Transformation | killexams.com Real Questions and Pass4sure dumps

    SAN FRANCISCO, Feb. 13, 2019 /PRNewswire/ -- IBM believe -- because the use of clever virtual assistants continues to develop, IBM (NYSE: IBM) these days announced extra global adoption of IBM Watson Assistant, an trade leading AI solution this is designed to support agencies retailer hundreds of thousands in operational fees and world firms engage with their consumers and personnel.

    Watson Assistant helps organizations control the giant and often wide range of client and worker carrier inquiries they container on an everyday foundation. businesses across greater than 15 industries including automotive, banking & financial functions, healthcare, telecommunications, manufacturing, and utility and know-how, use Watson Assistant to boost distinctive digital assistants that uniquely characterize their company attributes. These solutions assist businesses deliver short and consistent consumer provider event across all touchpoints while also assisting automate consumer assist operations – allowing personnel to focal point on better cost projects.

    "enterprise-grade AI digital assistants are more than simply chatbots," referred to Beth Smith, generic manager, IBM Watson. "a real commercial enterprise assistant understands when to look from a data base, when to ask for readability and when to direct clients to a human – assisting to unravel greater requests while decreasing misunderstandings and alleviating frustration for both personnel and purchasers."

    through a brand new integration with IBM Cloud deepest for statistics (ICP for information), Watson Assistant will also be run in any ambiance – on premises, or on any deepest, public, hybrid or multicloud – giving companies the capacity to practice an commercial enterprise-class, intelligent digital assistant to all of the enterprise's information. Watson Assistant also works with tools company already use by effortlessly integrating with CRM systems and channels – like fb and Slack.

    groups that have deployed Watson Assistant encompass:

    Bradesco, the 2nd biggest financial institution in Brazil, is the usage of Watson Assistant to increase aid and meet the evolving expectations of purchasers. Bradesco first deployed the Watson-enabled Bradesco Inteligencia synthetic (BIA)  assistant in 2016, which lately hit the mark of 87 million interactions with the financial institution's employees and customers. the usage of Watson, BIA takes about three seconds to answer questions and perform searches akin to stability and withdrawal queries, transfers, account payments, loans, investments and more.

    Nationwide constructing Society , a British mutual fiscal establishment and largest building society on earth with over 15 million contributors, is launching Arti, a Watson Assistant powered digital agent. Arti will work facet-by using-facet with Nationwide employees to boost their member adventure. firstly, Arti will act as a primary line of support for first-time domestic patrons, responding to preliminary inquiries – and will increase inquiries to a human agent as obligatory.

    SPF deepest consumers , one of the UK's main monetary capabilities corporations, has launched Ava, a new Watson-enabled digital support-to-buy mortgage adviser, assisting first time consumers onto the property ladder. offering around the clock support for queries, Ava augments the role of the ordinary adviser while offering an superior carrier to customers. Ava is proficient on 200 usual questions, providing short clear solutions that aid book consumers during the early tiers of the personal loan process. consumers can now get a loan advice in barely three minutes, a decision on precept prices in 15 minutes, and be connected to an guide for a full personal loan recommendation in 30 minutes.

    on-line retailer, Very.co.uk, a part of store Direct, launched a Watson Assistant powered chatbot during the 2018 break season. Their "Very Assistant Chatbot" is designed to answer and aid provider class questions comparable to 'where is my start' and 'what's the returns policy?'. Having beta verified the virtual assistant with a variety of valued clientele, Very.co.uk launched the digital assistant in time for the 2018 height buying and selling Christmas timeline. a focus on more advantageous customer provider and online self-carrier alternatives, together with the Very Assistant, helped store Direct reduce customer calls into contact centers with the aid of 30% right through its height trading period (seven weeks as much as and including December 28 2018).

    24 ORE community, the main Italian multimedia publishing enterprise across the financial, economic and knowledgeable suggestions sector, these days unveiled Alf (synthetic Loyal buddy), a Watson Assistant powered digital agent designed to assist tax specialists as they search for tips in the 24 ORE group's Plusplus24 Fisco AI database. Alf marks a big trade in the provider mannequin for Italian tax specialists, who've access to greater than 1.5 million files from really good magazines and media archives to permitted e-gaining knowledge of lessons and professional enterprise documentation for instant, correct solutions to their tax enquires.

    IBM's Watson career educate, MYCA, is a Watson Assistant-powered virtual assistant that interacts with personnel to be trained their abilities, interests and aspirations. MYCA helps to suit personnel with opportunities within their company they're qualified for today, in addition to, opportunities they may pursue with recommended trainings. so far, personnel and organizations have found MYCA's conversational method and information pushed ideas to helped to have effective influence on employee engagement retention, boom, and interior mobility. 

    agencies like NBC and Ernst & young are using yet another Watson-assistant powered tool, Watson Candidate Assistant, to help interact knowledge candidates. Watson Candidate Assistant engages candidates in customized profession discussions, past their skills, and recommends job roles, by inferring potential and event, from time to time even suggesting careers no longer in the past considered.

    About IBM Watson & synthetic Intelligence an international leader in AI for company, Watson options had been deployed in hundreds of engagements with purchasers across 20 industries and 80 international locations. additionally, IBM analysis is a global leader within the science of AI. In 2018, IBM secured over 1600 AI-connected patents. And, IBM these days published its leading-facet challenge Debater, created by using IBM analysis scientists.

    Media Contact: Brenna McCarthy, Brenna.Mccarthy@ibm.com, 646-832-0189

    View fashioned content material to down load multimedia:http://www.prnewswire.com/news-releases/ibm-watson-assistant-continues-to-force-world-enterprise-transformation-300794703.html

    supply IBM

    Copyright (C) 2019 PR Newswire. All rights reserved


    IBM analyze: Blockchain Brings have faith to How businesses, patrons and automobiles join | killexams.com Real Questions and Pass4sure dumps

    New analysis finds finance, give chain and mobility capabilities as key purposeful purposes for blockchain in automotive

    ARMONK, N.Y., Dec. 12, 2018 /PRNewswire/ -- a brand new IBM (NYSE: IBM) look at estimates that sixty two p.c of automobile executives consider blockchain will be a disruptive drive within the auto trade by 2021. besides the fact that children, the analysis also finds that most effective a small percentage of OEMs and suppliers are at the moment capable for blockchain or have a greater notion that blockchain solutions that are equipped for business use.

    IBM service provider brand. (PRNewsFoto/IBM organization) (PRNewsFoto/) (PRNewsfoto/IBM)

    more

    the brand new study, "Daring to be first, How auto pioneers are taking the plunge into blockchain," developed by the IBM Institute for business value (IBV) in collaboration with Oxford Economics, is the outcome of a survey with 1,314 automobile executives (OEMs and suppliers) across 10 business areas and 10 countries together with China, Germany, India and the united states.

    The world statistics revealed finance, give chain and mobility capabilities as suitable areas where blockchain can be beneficial. however, aftersales, the secondary market of the auto business, involved with the manufacturing, distribution, retailing, and installing of all car elements, also rated excessive for OEMs in China, Germany and Mexico. currently part traceability all the way through the lifecycle of a vehicle is terribly confined, which capability counterfeit elements can be used by means of provider facilities in some markets. imposing blockchain-based mostly options in the automobile deliver chain could resolve some of the issues around recollects, fake products and customer protection.

    The record additionally highlights how blockchain will introduce advancements and operational efficiencies in areas equivalent to economic transactions between ecosystem participants, authenticating access to vehicles and customer adventure and loyalty. It additionally finds that:

  • 54 p.c of executives predict new business models to have an effect on investments in blockchain. 
  • at least 50 % of the OEM executives in every country consider that blockchain options will have a high have an effect on on fleet administration capabilities. 
  • 55 p.c of OEMs and 47 p.c of suppliers say enforcing blockchain will enhance imperfect suggestions in their enterprise networks.
  • "we're in the very early stages for blockchain in auto, however there lies massive abilities," pointed out Ben Stanley, automobile analysis for IBM's Institute of enterprise price. "In 2019 we predict to peer blockchain birth to really take off, exceptionally with comfortable facts sharing, car and ride share transactions and in-vehicle marketplaces."

    IBM's research displays a gaggle of car pioneers -- 15 percent of all those surveyed -- which are already forging forward with blockchain, and a lot of plan to enforce their first business networks at scale in the subsequent three years.

    organizations like the Mobility Open Blockchain Initiative (MOBI) are already exploring using blockchain to aid make mobility safer, greater least expensive and greater broadly approved. some of MOBI's preliminary initiatives are focusing on comfortable mobility commerce; usage-primarily based mobility pricing and funds; and vehicle identity, heritage and usage.

    "The auto industry is capable that it needs to gain efficiencies right now," mentioned Chris Ballinger, CEO and Founder at MOBI.  "With its promise of creating mobility safer, greener, and greater purchasable, blockchain has the abilities to beef up believe and collaboration among corporations, patrons and even vehicles."

    About IBM For more advice about IBM features please consult with: https://www.ibm.com/capabilities

    Contact:Jeannine Kilbridejkilbri@us.ibm.com860-997-6277

    View long-established content to down load multimedia:http://www.prnewswire.com/news-releases/ibm-study-blockchain-brings-believe-to-how-agencies-consumers-and-automobiles-connect-300763976.html


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    Can Open-source Hardware Be Like Open-source Software? | killexams.com real questions and Pass4sure dumps

    Hardware and software are certainly different beasts. Software is really just information, and the storing, modification, duplication, and transmission of information is essentially free. Hardware is expensive, or so we think, because it’s made out of physical stuff which is costly to ship or copy. So when we talk about open-source software (OSS) or open-source hardware (OSHW), we’re talking about different things — OSS is itself the end product, while OSHW is just the information to fabricate the end product, or have it fabricated.

    The fabrication step makes OSHW essentially different from OSS, at least for now, but I think there’s something even more fundamentally different between the current state of OSHW and OSS: the pull request and the community. The success or failure of an OSS project depends on the community of people developing it, and for smaller projects that can hinge on the ease of a motivated individual digging in and contributing. This is the main virtue of OSS in my opinion: open-source software is most interesting when people are reading and writing that source.

    With pure information, it’s essentially free to copy, modify, and push your changes upstream so that others can benefit. The open hardware world is just finding its feet in this respect, but that’s changing as we speak, and I have great hopes. Costs of fabrication are falling all around, open and useful tools are being actively developed to facilitate interchange of the design information. I think there are lessons that OSHW can learn from the OSS community’s pull-request culture, and that will help push the hardware hacker’s art forward.

    What would it take to get you to build someone else’s OSHW project, improve on it, and contribute back? That’s a question worth a thoughtful deep dive.

    The Patch and the Pull Request

    Back in the early days of what we now think of as open-source software, there was the patch. Indeed, the UNIX utilities diff and patch are probably the unsung heroes of the OSS movement. They enabled a programmer to easily figure out the difference between two (source code) files and pass those changes on to someone else.

    Then along came Linux, which started off as a pet project of Linus Torvalds’, but grew to include so many contributors that handling the patch requests became a full-time job for Linus, and then for his “lieutenants” as he subdivided the responsibilities. When Linus needed a version control system for the Linux codebase, he wrote his own: git. No surprise, it was based on the idea of recording and handling incremental patches, but in a distributed manner that gave his lieutenants (but also anyone in the community) the autonomy they wanted to work on the code and then ask Linus to pull their changes in when ready.

    It’s easy enough to set up your own web-facing git repository to share your code with the world, but just as more people use e-mail or web-hosting services rather than rolling their own, it’s a lot easier to use a service for small projects. Add in a social-networking overlay to a public git repository, and you’ve got GitHub, the de facto means of sharing and working on OSS information. With a Wiki for community documentation helping you along the way, it’s all downright comfortable to tweak OSS these days.

    TL;DR: the heart and soul of OSS these days is pointing your browser at a website, copying the code, using it and improving it, and asking to get your improvements pulled back into the project the same way you got it in the first place. Easy-peasy.

    Costly Fabrication

    What would the pull-request cycle look like in the OSHW world? I download your design, look over the bill of materials (BOM), and decide to get a PCB manufactured and parts ordered. It arrives, and I play with it. Maybe I make modifications on the board itself or maybe, assuming that I can open up your design files, I make some modifications and order yet another version with my changes. If my changes work, I’ll submit a pull request back to you. Do you verify my changes by producing another one of your things? You can see where the friction introduced to the system by the need for fabrication raises its ugly head, two or three times: at least once for the changed version and once to verify that the change doesn’t break the original project. That’s something we need to work on.

    On one hand, small-scale manufacturing has never been easier or cheaper. Gone are the days of spending hundreds on prototype PCBs; there are sources everywhere that will get the job done so inexpensively that many otherwise respectable hackers don’t even consider producing a one-off board at home. Of course the home PCB fab has also never been cheaper, with CNC mills capable of routing a board coming in around $200, or the relative ease of getting good results at home even with toner transfer. Add to this the secret weapon of a well specified BOM, maybe even one that can be ordered with one click or CSV upload, and the frictions here can be minimized. So far, so good. At least it’s plausible that I could replicate your masterwork.

    If the fabrication costs are around $20 and a half-hour of time, I could maybe expect you, the diligent project maintainer, to approve one pull request per week, or maybe only if the patch improves the project enough to warrant a rebuild. But what if you ran three or five such successful projects? And it gets worse as a project scales up, of course. I wouldn’t expect a project owner to spin up a board with a $150 BOM cost just to verify my tweaks to the audio output section.

    For yourself and any potential contributors to the project, it’s probably worth thinking about making the design as inexpensive and non-time-consuming to fabricate as possible. If you want pull requests, you’ll be looping through fabrication more than once, so extra time here pays off. But with the capabilities of DIY and small-scale fabrication ever increasing, and the price of professional work dropping, the fabrication step is becoming less and less of a barrier, at least for small projects.

    Design for Modification

    What about big projects that are simply too intricate to replicate more than once or twice per user? Is there any hope for the pull request in ambitious OSHW projects?

    Adrian Bowyer’s Mendel

    If you look at the RepRap project as a whole, it certainly has resulted in the very rapid, distributed development of open-source 3D printers, but you might not expect downstream changes to percolate upwards very rapidly. After all, building any printer from scratch costs $300 to $600 or more, takes hours of time, and isn’t a task that someone’s going to undertake just to check out your pull request.

    But still, some of the most successful printers have a good degree of visible community contribution: the old Prusa Mendel has 30 pull requests, and the current Prusa 3 design scores 44. [Nophead], the designer of Mendel90, the other early square cartesian bot, was initially very reluctant to take community help. Interestingly, since he opened his project up on GitHub, he’s received 38 pull requests, and incorporated 35 of them. Success!

    How can this be? First, these printer designs are entirely open, written in the parametric, and very easy to tweak OpenSCAD language. OpenSCAD is itself free, as well. So anyone with a 3D printer who wants to try out a modification has a very low barrier to entry. And a 3D printer is also eminently modifiable and tweakable. Many of the sub-assemblies are entirely modular and can be swapped out at minimal cost. You don’t have to build a whole new printer to test out various new hot-end mount designs, and neither do [Jo Prusa] or [Nophead] when they accept your patch.

    Incremental changes are easiest to make when you only need to change one section, and not the global design. Modular design, with well-defined sub-units whenever possible, encourages improvement. (Am I talking about object-oriented coding or parts placement that locates the power supply off in a corner on its own on the PCB?) Can you use off-the-shelf breakout modules that are sourceable on the cheap that can be unplugged and reused in the next revision? Maybe you should.

    Open-Source Tools

    Releasing your design files to the world doesn’t mean anything if others can’t dig in and help you improve them, and that means that they have the tools to do the job. With code, all that’s really required is a text editor and maybe a compiler. With hardware, the “code” — the design files — are often wrapped up in proprietary tools, which instantly limits the audience of potential contributors.

    The obvious choice here is KiCad, which is open source and runs on everything. Of course, there’s still the learning curve that accompanies any package that’s not the one you’re used to, but until the entire industry settles on a compatible file format for schematic capture and PCB layout, you might as well choose the most open, widely available, and least encumbered tool.

    Eagle, which has had an XML export format since Version 6 in 2012, is another contender. The tool is free to use for small boards, and it has a large number of users. We know how to get files out of Eagle’s format very well these days, including exporting entire part libraries, which means that KiCad users can hack on your files. I don’t know if it’s possible to make the round trip, though; can one import KiCad files back into Eagle?

    There are many other tools, ranging in price from free to professional-use-only. For this article, I don’t care at all about their relative ease of use — if a large chunk of your target audience can’t use it, or if the file format doesn’t lend itself well to differences and revision tracking, you’re shutting out potential pull requests.

    The Fine Art of the README

    If there’s something else we can learn from the OSS world, it’s how important good and inviting documentation is to the success of a project, both for the end-user and for the potential hacker. And perhaps the first lesson here is that the distinction between end-user and hacker isn’t that great.

    The potential hacker will also be more likely to try your project out in the first place if it’s easy and appealing to make, just like the end-user. 77.23% of all statistics are made-up, but I’d bet that the overwhelming majority of folks contributing to OSS projects are satisfied, or maybe even slightly disgruntled, users of the software in question. So show potential builders how to build and use your project, but don’t forget to show potential hackers how it works and how they can get inside it. And if you want to accept pull requests, don’t forget to say so, out loud.

    Feedback?

    Can we build a pull-request culture in OSHW? I hope so, because that’s the best part of OSS, but I’m also realistic. The raw physicality of the real world will always get in the way to some extent, but the pure cost barrier of replication is shrinking year on year. After that, it’s a simple matter of software, and getting everyone to use interoperable design tools. Yeah, that’s hard.

    So in the mean time, what can you do to make your OSHW project more appealing for other hackers to contribute to? If the costs, both in labor and money, of replication are as low as possible, someone might make it. If they make it, how likely are they to improve it? That depends on how modifiable and modular the design is.

    If you’re using non-free software for the design, can the data at least be exported? Or can the user work around your inflexibility by simply exporting the design to the tool of their choice? Finally, how well documented and inviting is your project for potential contributors, not just in use, but also in modification? Do you say you encourage pull requests?

    Anyway, there’s some brainstorming about how we could make large-scale community OSHW work. Naturally, I’d love to hear your take, and examples of any successful projects with contributions from the public, in the comments. What else?


    Void-free, flux-free process for placement and attach of solder balls | killexams.com real questions and Pass4sure dumps

    Technique increases production yields of wafers, flip chips, CSPs and µBGA packages.

    RICHARD RAMOS

    As production of wafer bumping, chip scale packages (CSPs), micro ball grid array (µBGA) and flip chip packages increases, so does the need for cost-effective and high yield production. The present method can produce unacceptable yields because it requires the use of flux; when the flux liquifies during the reflow soldering operations, the bonds between the flux, balls and pads are destroyed and the balls are free to move. Defects, such as vacancies, bridging of adjacent balls, loss of positional accuracy and voids, are thus created. Flux residues are also not always completely removed during post-solder cleaning processes because of voids, and high resistance shorts and/or corrosion may result.

    To keep pace with the growing demand for flip chip technology and ball grid array (BGA) devices, high manufacturing yields are vital, and these yields must be improved to reduce manufacturing costs.

    Federal Regulations

    Many manufacturers have switched from solvent cleaning to aqueous saponification of rosin flux; many others are changing to water soluble organic flux. The primary considerations have been the continually rising costs of the solvents themselves, and to comply with Federal Environmental Protection Agency (EPA) and Occupational Safety and Health Agency (OSHA) regulations. The EPA has stringent categorical regulations on aqueous process effluents, as well.

    There have been some significant changes in the past three years in how the EPA looks at the effluent from flux cleaning machines used by semiconductor manufacturers and contract assembly houses. City municipalities, such as San Jose and Santa Clara in California, have refused to allow the effluent from these machines to be discharged into sewer systems. This has necessitated use of recycling flux cleaners, which require very expensive deionized water systems and heavy metal capture resins. Because these resins when exhausted contain hazardous amounts of toxic materials (lead), the EPA requires hazardous material handling and disposal permits, because nearly all of the companies involved are three-to-four times over the maximum allowable limits for daily heavy metal disposal.

    Effluent Standards

    For example, the pretreatment standards that must be met in disposing of effluents from wave soldering and aqueous cleaning of electronic assemblies are:

    • Federal regulations — These are categorical standards for uniform waste water treatment throughout the United States (Table 1).

    • Typical municipal regulations — Protection criteria for municipal waste water facilities, which are the direct interpretation of federal regulations at the local level (Table 2).

    It is clear from the data of Tables 1-5 that lead, BOD5, COD and pH standards were violated in three cases studied (these cases are presented in Tables 3-5). In the last case, TSS, copper and zinc standards were also violated.

    Flux-free Process

    While there were not any viable answers to this flux problem, there is a flux-free BGA, CSP, flip chip and wafer ball attach process for Sn/Pb or Pb/Sn solders available.

    This process requires that oxides be reduced. The dissociation pressure, PoM2 = PoA2 increases for all metals. Thus, for an atmosphere containing a given partial pressure of oxygen, there exists a critical temperature Tc, at which the boundary condition will apply, whereby:

    PoM2 > PoA2

    and the oxide will commence to dissociate spontaneously, according to thermodynamic theory.

    BGA Packages

    Fluxless, high-volume ball attachment is performed in a large-format, controlled-atmosphere furnace. The tooling for the machine is composed of an upper and lower plate machined from graphite material.

    The mating top plate or alignment/ loading plate is made from two inseparable plates that serve to load and align the balls. The lower plate contains a series of hole patterns that correspond exactly to the specified pad pattern of the BGA packages. The upper plate contains the same hole pattern as the lower plate and serves as a spring loaded “shutter” during the loading process. Dowel pins are inserted into the carrier and are allowed to protrude above the plane of the top surface. The carrier cavities are loaded with BGA packages and the alignment/loading plate is made to mate with the carrier by way of the dowel pins.

    During the loading process, balls are placed onto the alignment/loading plate and fall into the open holes of the shutter. The shutter is approximately half the thickness of the balls, which ensures that a single ball will fill each hole. Once the shutter is full, a drain hole is provided so excess balls can be poured off; at this point, the balls are released by pushing the spring loaded shutter. The alignment plate is thicker than the shutter, which allows the balls enough space to completely clear the shutter on the return stroke; as a result, the balls can be precisely located on the BGA pads.

    The fully loaded carrier assemblies are then placed in handling frames. Loaded handling frames can be maneuvered manually or by robots. The sectioned configuration of a loaded handling frame is shown in Figure 1. The chamber contains three graphite platens, which are the heat-generating medium. After placing two loaded handling frames on each platen (Figure 2), the solder profile is programmed into the memory of a microprocessor. Table 6 shows a typical profile for attaching solder balls to BGA packages.

    The lid of the chamber is then closed and the air withdrawn. The chamber is backfilled with an appropriate inert gas, and an electrical current is passed through the platens. Because the graphite material is a poor electrical conductor, the platens are rapidly heated to the soldering temperature. Heat is conducted into the carrier assemblies from the platens. A vacuum bake operation is usually included in the solder profile just before ramping to the soldering temperature (Table 6). Therefore, any contaminating volatiles, such as entrapped water moisture, can be eliminated.

    Once the solder balls reach liquidous, the solder material reacts with the gold surface of the BGA pads. The tin constituent of the solder alloy consumes the gold, and the solder wets the underlying metallization. Upon cooling, the surface tension within the molten solder mass causes the solder to form a ball-shaped structure during solidification. The visual appearance of the solidified mass is not unlike the original spherical shape of the solder balls, except that the solder at the base of the structure forms a fillet around the entire perimeter of the pad. The fillet indicates that good wetting has occurred between the solder and pad.

    Because the tooling locates and restrains solder balls on the pads to within 0.001″, defects, such as vacancies, bridging and loss of positional accuracy, are avoided.

    The soldering technique, called pressure variation, uses as an advantage the reduction of the oxides in a vacuum and the pressure differential to eliminate voids. This method can be used to make large-area joints using solder preforms that have void levels consistently below five percent. More commonly referred to as Boyle`s Law, where:

    P1 = initial pressure

    P2 = final pressure

    V1 = initial void volume

    V2 = final void volume

    Solving the equation for final void volume (V2 = V1 (P1/P2): Therefore, the greater P2 is in relation to P1, the more effective the process.

    Flip Chip and Wafer Applications

    An effective fluxless, high-volume method for positioning and attaching solder balls to wafers makes use of controlled-atmosphere furnace equipment. Because many thousands of balls are attached to each individual wafer, precise positioning is of primary importance. For unequaled accuracy, balls under .001″ are solder-plated then reflowed in the vacuum atmosphere to produce void-free, flux-free ball attach on .001″ or smaller balls.

    The lid of the chamber is closed and the balls are automatically soldered to the pads in much the same way as previously described for BGA packages. Hot carrier assemblies can be removed by hand from the chamber using quick-release handles and studs or chamber loading and unloading operations can be performed by robots.

    Conclusion

    The fluxless, high volume method for attaching solder balls to BGA packages and wafers can produce good-quality solder joints (Figures 3 and 4). The precision tooling locates and restrains the balls in the required position during processing. Vacancy, bridging and loss of positional accuracy defects can be nearly eliminated, resulting in maximized production yields. AP

    Acknowledgments

    Special thanks to Stan Bernstein (Alpha Metals, Jersey City, N.J.) and James Green (Environmental Management and Planning Engineering, Nashville, Tenn.) for their contributions to this paper.

    RICHARD RAMOS, executive vice president and division general manager, can be contacted at Scientific Sealing Technology, 9801 Everest Street, Downey, CA 90242; 562-803-3361; Fax: 562-803-4043; E-mail: rramos@sst-tech.com.

    Click here to enlarge image

    Figure 1. Loaded handling frame cross-sectioned in the plane referenced in Figure 2. The captured solder balls are aligned with the BGA pads. The walls of the alignment plate holes prevent the balls from moving during processing.

    Click here to enlarge image Click here to enlarge image Click here to enlarge image Click here to enlarge image Click here to enlarge image

    Figure 2. Two fully loaded holding frames positioned end-to-end on a platen.

    Click here to enlarge image Click here to enlarge image


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